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Refractory Metals - Composites -Special Alloys - Ceramics -Tungsten - Titanium


Aluminum Nitride Products

The Aluminium Nitride product is a new material having such characteristics as superior thermal conductivity, high electric insulation, and coefficient of thermal expansion similar to that of silicon (Si) and is drawing attention as a next-generation material with high thermal conductivity

  • High thermal conductivity about 7 times that of Alumina
  • Having coefficient of thermal expansion similar to that of silicon, it realizes a high
  • reliability against installation of a large Si chip and heat cycle
  • High electric insulation, and low dielectric constant
  • Mechanical strength higher than that of Alumina
  • Superior corrosion resistance against molten metal
  • Very small content of impurities, no toxicity, high purity.
Physical properties (principal values)

Characteristic value

Unit

Sheet formed product Press molded product  
Density
g/cm3
33 3.3  
Thermal conductivty

W/m•k (R.T.)

170 160  
Coefficient of thermal expansion x10-6/ºC (R.T.~400ºC) 4.6 4.6  
Dielectric strength KV/mm (R.T.) 15 15  
Volume resistivity Ω•cm (R. T.) 1014 1014  
Dielectric constant 1MHz (R.T.) 9.0 9.0  
Bending strength MPa (R.T.) 450 300

Board, general tolerance

Thermal Conductivity

           
Item Sheet formed product Press molded product

01ni_al-01.gif

Dimension Max. 5"x7" Max. 2"x2"
Thickness 0.5~1.5
(as fired)
0.3~1.0
(lapped)
1~8 mm
Dimensional tolerance ±1%NLT
±0.1 mm
±1%NLT
±0.1 mm
Thickness tolerance * ±10% ±10%

Coefficient of thermal expansion

Warp tolerance ** ≤0.003mm/mm ≤0.003mm/mm

01ni_al-02.gif

*Thickness tolerance of both-side polished product : ±0.05 mm
** Warp of both-sided polished product: ±0.0015 mm/mm
     
     
     
           
Physical properties (principal values)
Characteristic value Unit Sheet formed product Press molded product    
Density g/cm3 3.3 3.3    
Thermal conductivity W/m•k (R.T.) 170 160    
Coefficient of thermal expansion x10-6/ºC (R.T.~400ºC) 4.6 4.6    
Dielectric strength
KV/mm (R.T.)
15 15    
Volume resistivity Ω•cm (R. T.) 1014 1014  


Application

  • Power transistor module board
  • High-frequency device boar
  • Radiating/insulating plate for thyristor
  • Mount board for semiconductor laser and light emission diode
  • Hybrid module, ignition module
  • IC package
  • Thermo-module board
  • Parts of semiconductor manufacturing equipment
Power Module

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