Ceramics > Ceramic Substrates
Advanced ceramic material for high power hybrid semiconductor packaging where high thermal conductivity is required. AlN substrates have a thermal conductivity of 170 W/Mk and available in standard thicknesses in sizes up to 100 mm (4") square.
SiC substrates are formed using a proprietary CVD process, are extremely uniform, 5Ns pure, and 100% dense.
Contact our office for details of our ceramic substrate materials and capabilities.
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