Refractory Metals - Composites -Special Alloys -
Ceramics -Tungsten - Titanium
Advanced ceramic material
for high power hybrid
semiconductor packaging where high thermal conductivity is
required. AlN substrates
have a thermal conductivity of 170 W/Mk
and available in standard thicknesses in sizes up to 100 mm (4")
are formed using a proprietary
, are extremely uniform, 5Ns pure, and 100% dense.
Please "Contact Us" for details of our
ceramic substrate materials and capabilities.