Refractory Metals - Composites -Special Alloys - Ceramics -Tungsten - Titanium


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Refractory Metals - Composites -Special Alloys - Ceramics -Tungsten - Titanium

Ceramic Substrates

Aluminum Nitride

Advanced ceramic material for high power hybrid semiconductor packaging where high thermal conductivity is required. AlN substrates have a thermal conductivity of 170 W/Mk and available in standard thicknesses in sizes up to 100 mm (4") square.

Silicon Carbide

SiC substrates are formed using a proprietary CVD process, are extremely uniform, 5Ns pure, and 100% dense.

Please "Contact Us"  for details of our ceramic substrate materials and capabilities.

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